Power savings can exceed 30% of total chip power, depending on extent of deployment. Typical power savings for multi-GHz designs are around 15% of total chip power.
2% to 5% when using top-level metal layer for the inductors.
Yes, one can use any existing tools along with the Cyclos RCM Compiler to integrate the Cyclos power-saving technology into high-performance semiconductors
Yes, either incremental or deep scaling will work.
Yes, both are supported.
No, same wafer and package testing as before.
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